doc. no : qw0905- rev. : date : - 2016 07 -apr. l8ug31040-b01-pf/tbs-x a data sheet ligitek electronics co.,ltd. property of ligitek only round type led lamps l8ug31040-b01-pf/tbs-x pb lead-free parts l dcc
note : 1.all dimension are in millimeter tolerance is page 1/7 ligitek electronics co.,ltd. property of ligitek only part no.l8ug31040-b01-pf/tbs-x l8ug31040/a-pf-b01 t d h1 l h2 w0 w1 w3 p1 p f - + p2 w2 + - 1.0min 0.5 5.3 2.54typ 2.95 3.86 2.92 3.62 25.0min 1.5min
2/7 page ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 nm lens material emitted green color dominant part no typical electrical & optical characteristics (ta=25 ? v
page 3/7 ligitek electronics co.,ltd. property of ligitek only max. part no. l8ug31040-b01-pf/tbs-x ug chip min. 350 a16 group luminous intensity(mcd) at 20 ma brightness code for standard led lamps 450 350 a17 300 a15 220 300 9 8 574 572 572 570 color code group 6 7 ug chip 570 568 max. 566 568 min. wave length(nm) at 20 ma 220 160 a14 a13 120 160 a18450550
l8ug31040-b01-pf/tbs-x remark:tbs=tape and box straight leads overall thickness h501.97 602.4 quantity/box 2500pcs dimensions symbol information ? ??? ?? ???? ? ?? ? ??? ??? ?? ?? ? ?? ???? ????? ????? ??? ? ?? ??? ? ? ? ?? ??? ??? ?
directivity radiation 5/7 page part no. l8ug31040-b01-pf/tbs-x 8ug chip ligitek electronics co.,ltd. property of ligitek only typical electro-optical characteristics curve 40 50 60 2.5 1.5 1.0 0.5 2.0 1.0 3.0 2.0 0 1000 100 10 1.0 30 20 10 0 0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) 60 4080 -20020 0 20 2.5 2.0 1.5 1.0 1.1 1.0 1.2 0.9 0.5 0 6080 -2040 0.8 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 ??? ?
page 6/7 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 400 150 265 260 100 120 50 0 25 0 60 seconds max preheat 2
ligitek electronics co.,ltd. property of ligitek only reference standard description page 7/7 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 test condition test item reliability test: operating life test high temperature storage test low temperature storage test 1.ta=65 ?? ?? ????? ????? ?? ????? ?? ????? ??
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